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may 2006 rev 2 1/24 1 m27c256b 256 kbit (32kb 8) uv eprom and otp eprom feature summary 5v 10% supply voltage in read operation access time: 45ns low power consumption: ? active current 30ma at 5mhz ? standby current 100a programming voltage: 12.75v 0.25v programming time: 100s/word electronic signature ? manufacturer code: 20h ? device code: 8dh ecopack? packages available 1 28 28 1 fdip28w (f) pdip28 (b) plcc32 (c) www.st.com
contents m27c256b 2/24 contents 1 summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 system considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 presto ii programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 program inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 program verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 erasure operation (applies for uv eprom) . . . . . . . . . . . . . . . . . . . . . . . 11 3 maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 dc and ac parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
m27c256b list of tables 3/24 list of tables table 1. signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 2. operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 3. electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 4. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 5. ac measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 6. capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 7. read mode dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 8. programming mode dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 9. read mode ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 10. read mode ac characteristics 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 11. programming mode ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 12. fdip28wb - 28 pin ceramic frit -seal dip, with win dow (round 0.280"), package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 13. pdip28 - 28 pin plastic dip, 600 mils width, package mechanical data . . . . . . . . . . . . . . 20 table 14. plcc32 - 32 pin rectangular plastic leaded chip carrier, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 15. ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 16. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
list of figures m27c256b 4/24 list of figures figure 1. logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. dip connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. lcc connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. programming flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 5. ac testing input output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 6. ac testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 7. read mode ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 8. programming and verify modes ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 9. fdip28wb - 28 pin ceramic frit-seal dip, with window, package outline . . . . . . . . . . . . . 19 figure 10. pdip28 - 28 pin plastic dip, 600 mils width, package outline . . . . . . . . . . . . . . . . . . . . . . 20 figure 11. plcc32 - 32 pin rectangular plastic leaded chip carrier, package outline. . . . . . . . . . . 21
m27c256b summary description 5/24 1 summary description the m27c256b is a 256 kbit eprom offered in the two ranges uv (ultra violet erase) and otp (one time programmable). it is ideally suited for micropro cessor systems and is organized as 32,768 by 8 bits. the fdip28w (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. a new pattern can then be written to the device by following the programming procedure. for applications where the content is programmed only one time and erasure is not required, the m27c256b is offered in pdip28 and plcc32 packages. in order to meet environmental requirements, st offers the m27c256b in ecopack? packages. ecopack packages are lead-free. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com . figure 1. logic diagram ai00755b 15 a0-a14 q0-q7 v pp v cc m27c256b g e v ss 8
summary description m27c256b 6/24 figure 2. dip connections table 1. signal names a0-a14 address inputs q0-q7 data outputs e chip enable g output enable v pp program supply v cc supply voltage v ss ground nc not connected internally du don?t use a1 a0 q0 a7 a4 a3 a2 a6 a5 a13 a10 a8 a9 q7 a14 a11 g e q5 q1 q2 q3 v ss q4 q6 a12 v pp v cc ai00756 m27c256b 8 1 2 3 4 5 6 7 9 10 11 12 13 14 16 15 28 27 26 25 24 23 22 21 20 19 18 17
m27c256b summary description 7/24 figure 3. lcc connections ai00757 a13 a8 a10 q4 17 a0 nc q0 q1 q2 du q3 a6 a3 a2 a1 a5 a4 9 a14 a9 1 v pp a11 q6 a7 q7 32 du v cc m27c256b a12 nc q5 g e 25 v ss
device operation m27c256b 8/24 2 device operation the operating modes of the m27c256b are listed in the operating modes. a single power supply is required in the read mode. all inputs are ttl levels except for v pp and 12v on a9 for electronic signature. 2.1 read mode the m27c256b has two control functions, both of which must be logically active in order to obtain data at the outputs. chip enable (e ) is the power control and should be used for device selection. output enable (g ) is the output control and should be used to gate data to the output pins, independent of device selection. assuming that the addresses are stable, the address access time (t avqv ) is equal to the delay from e to output (t elqv ). data is available at the output after delay of t glqv from the falling edge of g , assuming that e has been low and the addresses have been stable for at least t avqv -t glqv . 2.2 standby mode the m27c256b has a standby mode which reduces the supply current from 30ma to 100a. the m27c256b is placed in the standby mode by applying a cmos high signal to the e input. when in the standby mode, the outputs are in a high impedance state, independent of the g input. 2.3 two-line output control because eproms are usually used in larger me mory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. the two line control function allows: the lowest possible memory power dissipation, complete assurance that output bus contention will not occur. for the most efficient use of these two control lines, e should be decoded and used as the primary device selecting function, while g should be made a common connection to all devices in the array and connected to the read line from the system control bus. this ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is desired from a particular memory device.
m27c256b device operation 9/24 2.4 system considerations the power switching characteristics of advance cmos eproms require careful decoupling of the devices. the supply current, i cc , has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the fallin g and rising edges of e . the magnitude of this transient current peaks is dependent on the capacitive and inductive loading of the device at the output. the associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. it is recommended that a 0.1f ceramic capacitor be used on every device between v cc and v ss . this should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. in addition, a 4.7f bulk elec trolytic capacitor should be used between v cc and v ss for every eight devices. the bulk capacitor should be located near the power supply connection point. the purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of pcb traces. 2.5 programming when delivered (and after each erasure for uv eprom), all bits of the m27c256b are in the "1" state. data is introduced by selectively programming "0"s into the desired bit locations. although only "0"s will be progra mmed, both "1"s and "0"s can be present in the data word. the only way to change a '0' to a '1' is by die exposure to ultraviolet light (uv eprom). the m27c256b is in the programming mode when v pp input is at 12.75v, g is at v ih and e is pulsed to v il . the data to be programmed is applied to 8 bits in parallel to the data output pins. the levels required for the address and data inputs are ttl. v cc is specified to be 6.25v 0.25 v. 2.6 presto ii programming algorithm presto ii programming algorithm allows to program the whole array with a guaranteed margin, in a typical time of 3.5 seconds. programming with presto ii involves the application of a sequence of 100s program pulses to each byte until a correct verify occurs (see figure 4. ). during programming and verify operation, a margin mode circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. no overprogram pulse is applied si nce the verify in margin mode provides necessary margin to each programmed cell.
device operation m27c256b 10/24 figure 4. programming flowchart 2.7 program inhibit programming of multiple m27c256bs in parallel with different data is also easily accomplished. except for e , all like inputs including g of the parallel m27c256b may be common. a ttl low level pulse applied to a m27c256b's e input, with v pp at 12.75v, will program that m27c256b. a high level e input inhibits the other m27c256bs from being programmed. 2.8 program verify a verify (read) should be performed on the programmed bits to determine that they were correctly programmed. the verify is accomplished with g at v il , e at v ih , v pp at 12.75v and v cc at 6.25v. 2.9 electronic signature the electronic signature (es) mode allows the reading out of a binary code from an eprom that will identify its manufacturer an d type. this mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. the es mode is functional in the 25c 5c ambient temperature range that is required when programming the m27c256b. to activate the es mode, the programming equipment must force 11.5v to 12.5v on address line a9 of the m27c256b, with v cc = v pp = 5v. two identifier bytes may then be sequenced from the device outputs by toggling address line a0 from v il to v ih . all other address lines must be held at v il during electronic signature mode. byte 0 (a0 = v il ) represents the manufacturer code and byte 1 (a0 = v ih ) the device identifier code. for the stmicroelectronics m27c256b, these two identifier bytes are given in ta b l e 3 and can be read-out on outputs q7 to q0. ai00760b n = 0 last addr verify e = 100 s pulse ++n = 25 ++ addr v cc = 6.25v, v pp = 12.75v fail check all bytes 1st: v cc = 6v 2nd: v cc = 4.2v yes no yes no yes no
m27c256b device operation 11/24 2.10 erasure operation (applies for uv eprom) the erasure characteristics of the m27c256b is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 ?. it should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 ? range. research shows that constant exposure to room level fluorescent lighting could erase a typical m27c256b in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. if the m27c256b is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the m27c256b window to prevent unintentional erasure. the recommended erasure procedure for the m27c256b is exposure to short wave ultraviolet light which has wavelength 2537?. the integrated dose (i.e. uv intensity x exposure time) for erasure should be a minimum of 15 w-sec/cm 2 . the erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 w/cm 2 power rating. the m27c256b should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. some lamps have a filter on their tubes which should be removed before erasure. table 2. operating modes (1) 1. x = v ih or v il , v id = 12v 0.5v. mode e g a9 v pp q7-q0 read v il v il xv cc data out output disable v il v ih xv cc hi-z program v il pulse v ih xv pp data in verify v ih v il xv pp data out program inhibit v ih v ih xv pp hi-z standby v ih xxv cc hi-z electronic signature v il v il v id v cc codes table 3. electronic signature identifier a0 q7 q6 q5 q4 q3 q2 q1 q0 hex data manufacturer?s code v il 00100000 20h device code v ih 10001101 8dh
maximum rating m27c256b 12/24 3 maximum rating stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. refer also to the stmicroelectronics sure program and other relevant quality documents. table 4. absolute maximum ratings symbol parameter value unit t a ambient operating temperature (1) 1. depends on range. ?40 to 125 c t bias temperature under bias ?50 to 125 c t stg storage temperature ?65 to 150 c v io (2) 2. minimum dc voltage on input or output is ?0.5v wi th possible undershoot to ?2.0v for a period less than 20ns. maximum dc voltage on output is v cc +0.5v with possible overshoot to v cc +2v for a period less than 20ns. input or output voltage (except a9) ?2 to 7 v v cc supply voltage ?2 to 7 v v a9 (2) a9 voltage ?2 to 13.5 v v pp program supply voltage ?2 to 14 v
m27c256b dc and ac parameters 13/24 4 dc and ac parameters this section summarizes the operating and measurement conditions, and the dc and ac characteristics of the device. the parameters in the dc and ac characteristic tables that follow are derived from tests performed under the measurement conditions summarized in the relevant tables. designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. figure 5. ac testing input output waveform table 5. ac measurement conditions high speed standard input rise and fall times 10ns 20ns input pulse voltages 0 to 3v 0.4v to 2.4v input and output timing ref. voltages 1.5v 0.8v and 2v ai01822 3v high speed 0v 1.5v 2.4v standard 0.4v 2.0v 0.8v
dc and ac parameters m27c256b 14/24 figure 6. ac testing load circuit table 6. capacitance (1) (2) 1. sampled only, not 100% tested. 2. (t a = 25 c, f = 1 mhz) symbol parameter test condition min max unit c in input capacitance v in = 0v 6 pf c out output capacitance v out = 0v 12 pf table 7. read mode dc characteristics (1) (2) 1. t a = 0 to 70c, ?40 to 85c, ?40 to 105c or ?40 to 125c; v cc = 5v 5% or 5v 10%; v pp = v cc . 2. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol parameter test condition min max unit i li input leakage current 0v v in v cc 10 a i lo output leakage current 0v v out v cc 10 a i cc supply current e = v il , g = v il , i out = 0ma, f = 5mhz 30 ma i cc1 supply current (standby) ttl e = v ih 1ma i cc2 supply current (standby) cmos e > v cc ? 0.2v 100 a i pp program current v pp = v cc 100 a v il input low voltage ?0.3 0.8 v v ih (3) 3. maximum dc voltage on output is v cc +0.5v. input high voltage 2 v cc + 1 v v ol output low voltage i ol = 2.1ma 0.4 v v oh output high voltage ttl i oh = ?1ma 3.6 v output high voltage cmos i oh = ?100a v cc ? 0.7v v ai01823b 1.3v out c l c l = 30pf for high speed c l = 100pf for standard c l includes jig capacitance 3.3k ? 1n914 device under test
m27c256b dc and ac parameters 15/24 table 8. programming mode dc characteristics (1) (2) 1. t a = 25 c; v cc = 6.25v 0.25v; v pp = 12.75v 0.25v. 2. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol parameter test condition min max unit i li input leakage current v il v in v ih 10 a i cc supply current 50 ma i pp program current e = v il 50 ma v il input low voltage ?0.3 0.8 v v ih input high voltage 2 v cc + 0.5 v v ol output low voltage i ol = 2.1ma 0.4 v v oh output high voltage ttl i oh = ?1ma 3.6 v v id a9 voltage 11.5 12.5 v
dc and ac parameters m27c256b 16/24 figure 7. read mode ac waveforms ) table 9. read mode ac characteristics (1) (2) 1. t a = 0 to 70c, ?40 to 85c, ?40 to 105c or ?40 to 125c; v cc = 5v 5% or 5v 10%; v pp = v cc 2. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol alt parameter test condition m27c256b unit -45 (3) 3. speed obtained with high speed ac measurement conditions. -60 -70 -80 min max min max min max min max t avqv t acc address valid to output valid e = v il , g = v il 45 60 70 80 ns t elqv t ce chip enable low to output valid g = v il 45 60 70 80 ns t glqv t oe output enable low to output valid e = v il 25 30 35 40 ns t ehqz (4) 4. sampled only, not 100% tested. t df chip enable high to output hi-z g = v il 025030030030ns t ghqz (4) t df output enable high to output hi-z e = v il 025030030030ns t axqx t oh address transition to output transition e = v il , g = v il 0000ns ai00758b taxqx tehqz a0-a14 e g q0-q7 tavqv tghqz tglqv telqv valid hi-z valid
m27c256b dc and ac parameters 17/24 ) table 10. read mode ac characteristics 2 (1) (2) 1. t a = 0 to 70c, ?40 to 85c, ?40 to 105c or ?40 to 125c; v cc = 5v 5% or 5v 10%; v pp = v cc 2. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol alt parameter test condition m27c256b unit -90 -10 -12 -15/-20/-25 min max min max min max min max t avqv t acc address valid to output valid e = v il , g = v il 90 100 120 150 ns t elqv t ce chip enable low to output valid g = v il 90 100 120 150 ns t glqv t oe output enable low to output valid e = v il 40 50 60 65 ns t ehqz (3) 3. sampled only, not 100% tested. t df chip enable high to output hi-z g = v il 0 30 0 30 0 40 0 50 ns t ghqz (3) t df output enable high to output hi-z e = v il 0 30 0 30 0 40 0 50 ns t axqx t oh address transition to output transition e = v il , g = v il 000 0 ns
dc and ac parameters m27c256b 18/24 figure 8. programming and verify modes ac waveforms table 11. programming mode ac characteristics (1) (2) 1. t a = 25 c; v cc = 6.25v 0.25v; v pp = 12.75v 0.25v. 2. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol alt parameter test condition min max unit t avel t as address valid to chip enable low 2 s t qvel t ds input valid to chip enable low 2 s t vphel t vps v pp high to chip enable low 2 s t vchel t vcs v cc high to chip enable low 2 s t eleh t pw chip enable program pulse width 95 105 s t ehqx t dh chip enable high to input transition 2 s t qxgl t oes input transition to output enable low 2 s t glqv t oe output enable low to output valid 100 ns t ghqz t dfp output enable high to output hi-z 0 130 ns t ghax t ah output enable high to address transition 0 ns tavel valid ai00759 a0-a14 q0-q7 v pp v cc g data in data out e tqvel tvphel tvchel tehqx teleh tglqv tqxgl tghqz tghax program verify
m27c256b package mechanical 19/24 5 package mechanical figure 9. fdip28wb - 28 pin ceramic frit -seal dip, with window, package outline 1. drawing is not to scale. table 12. fdip28wb - 28 pin ceramic frit-seal dip, with window (round 0.280"), package mechanical data symbol millimeters inches typ min max typ min max a 5.72 0.225 a1 0.51 1.40 0.020 0.055 a2 3.91 4.57 0.154 0.180 a3 3.89 4.50 0.153 0.177 b 0.41 0.56 0.016 0.022 b1 1.45 ? ? 0.057 ? ? c 0.23 0.30 0.009 0.012 d 36.50 37.34 1.437 1.470 d2 33.02 ? ? 1.300 ? ? e 15.24 ? ? 0.600 ? ? e1 13.06 13.36 0.514 0.526 e2.54? ?0.100? ? ea 14.99 ? ? 0.590 ? ? eb 16.18 18.03 0.637 0.710 l 3.18 4.10 0.125 0.161 s 1.52 2.49 0.060 0.098 ? 7.11 ? ? 0.280 ? ? 4 11 4 11 n28 28 fdipw-a a3 a1 a l b1 b e d s e1 e n 1 c ea d2 ? eb a2
package mechanical m27c256b 20/24 figure 10. pdip28 - 28 pin plastic di p, 600 mils width, package outline 1. drawing is not to scale. table 13. pdip28 - 28 pin plastic dip, 600 mils width, package mechanical data symbol millimeters inches typ min max typ min max a 4.445 0.1750 a1 0.630 0.0248 a2 3.810 3.050 4.570 0.1500 0.1201 0.1799 b 0.450 0.0177 b1 1.270 0.0500 c 0.230 0.310 0.0091 0.0122 d 36.830 36.580 37.080 1.4500 1.4402 1.4598 d2 33.020 ? ? 1.3000 ? ? e 15.240 0.6000 e1 13.720 12.700 14.480 0.5402 0.5000 0.5701 e1 2.540 ? ? 0.1000 ? ? ea 15.000 14.800 15.200 0.5906 0.5827 0.5984 eb 15.200 16.680 0.5984 0.6567 l 3.300 0.1299 s 1.78 2.08 0.070 0.082 0 10 0 10 n28 28 pdip a2 a1 a l b1 b e1 d s e1 e n 1 c ea eb d2
m27c256b package mechanical 21/24 figure 11. plcc32 - 32 pin rectangular plastic leaded chip carrier, package outline 1. drawing is not to scale. table 14. plcc32 - 32 pin rectangular plastic leaded chip carrier, package mechanical data symbol millimeters inches typ min max typ min max a 3.17 3.56 0.125 0.140 a1 1.53 2.41 0.060 0.095 a2 0.38 ? 0.015 ? b 0.33 0.53 0.013 0.021 b1 0.66 0.81 0.026 0.032 cp 0.10 0.004 d 12.32 12.57 0.485 0.495 d1 11.35 11.51 0.447 0.453 d2 4.78 5.66 0.188 0.223 d3 7.62 ? ? 0.300 ? ? e 14.86 15.11 0.585 0.595 e1 13.89 14.05 0.547 0.553 e2 6.05 6.93 0.238 0.273 e310.16? ?0.400? ? e1.27? ?0.050? ? f 0.00 0.13 0.000 0.005 r0.89? ?0.035? ? n32 32 plcc-a d e3 e1 e 1 n d1 d3 cp b e2 e b1 a1 a r 0.51 (.020) 1.14 (.045) f a2 e2 d2 d2
part numbering m27c256b 22/24 6 part numbering for a list of available options (speed, package, etc) or for further information on any aspect of this device, please contact the stmicr oelectronics sales office nearest to you. table 15. ordering information scheme example: m27c256b -70 x c 1 tr device type m27 supply voltage c = 5v device function 256b = 256 kbit (32kb x 8) speed -45 (1) = 45 ns 1. high speed, see ac characteristi cs section for further information. -60 = 60 ns -70 = 70 ns -80 = 80 ns -90 = 90 ns -10 = 100 ns -12 = 120 ns -15 = 150 ns -20 = 200 ns -25 = 250 ns v cc tolerance blank = 10% x = 5% package f = fdip28w b = pdip28 c = plcc32 temperature range 1 = 0 to 70 c 3 = ?40 to 125 c 6 = ?40 to 85 c options tr = tape & reel packing
m27c256b revision history 23/24 7 revision history table 16. document revision history date version revision details july 1998 1.0 first issue 20-sep-2000 1.1 an620 reference removed 29-nov-2000 1.2 plcc codification changed ( ta b l e 1 5 . ) 02-apr-2001 1.3 fdip28w mechanical dimensions changed ( table 12. ) 29-aug-2002 1.4 package mechanical data clarified for pdip28 ( table 13. ), plcc32 ( table 14. , figure 11. ) and tsop28 ( table 15. , figure 13. ) 18-may-2006 2 document converted to new template (sections added, information moved). tsop28 package removed. packages are ecopack? compliant. x option removed from table 15: ordering information scheme .
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